功能特點(diǎn)

FEATURES:

1. 消除基材表面靜電，清潔活化基材表面，提高基材表面能，提升粘膠與基材的附著力。

Eliminate static electricity on the surface of the substrate, clean the surface of the activated substrate, improve the surface energy of the substrate, and improve the adhesion of the adhesive to the substrate.

2. 等離子溫度低，不損傷基材。

The plasma temperature is low and does not damage the substrate.

3. 不產(chǎn)生電弧，不損傷被處理產(chǎn)品的芯片。

No arcing, no damage to the chip of the processed product.